Funding

Switzerland’s Neurosoft Bioelectronics Raises $7.5M Funding In Seed Round

May 21, 2026 | By Team SR

Neurosoft Bioelectronics, a neurotechnology company based in Geneva, Switzerland, and New York City, raised $7.5 million in Seed funding to advance its soft brain-computer interface (BCI) technology.

SUMMARY

  • Neurosoft Bioelectronics, a neurotechnology company based in Geneva, Switzerland, and New York City, raised $7.5 million in Seed funding to advance its soft brain-computer interface (BCI) technology.

The round was led by Skybound Venture Capital, with participation from PL Capital, IAG Capital Partners, Connecticut Innovations, and other investors, bringing the company’s total funding to more than $20 million.

The new capital will support the development of its minimally invasive brain interface platform already tested in 10 patients and accelerate work on a cortical foundation model for next-generation BCIs.

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Led by CEO Nicolas Vachicouras Neurosoft Bioelectronics develops stretchable, scalable BCIs. Originating from EPFL the company’s proprietary soft electrode technology enables full-cortical access without penetrating brain tissue, supporting advanced neural data collection.

“Our soft electrode platform, paired with a streamlined regulatory pathway, gives us access to neural data at a quality and scale no other approach can safely match today,” said Nicolas Vachicouras, PhD, CEO and Co-Founder of Neurosoft Bioelectronics. “That data is the foundation for improved clinical outcomes, and a cortical foundation model that will help shape the next generation of brain interfaces. The investor support we’ve seen in this round validates that we’re on the right path.”

About Neurosoft Bioelectronics

Founded in 2020 Neurosoft Bioelectronics develops soft, minimally invasive brain-computer interface technologies for patients with neurological disorders. The company creates highly flexible implantable neural electrodes designed for long-term integration with the body, aiming to improve treatment outcomes and enable new possibilities in neural interfacing and advanced neurotechnology applications.

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