QuantumDiamonds Raises €91 Mn in Round

The funding includes €15 million in equity investment, led by World Fund, and €76 million in non-dilutive funding approved under the European Chips Act. This government-backed funding is provided by the German Federal Ministry for Economic Affairs and Energy and the Free State of Bavaria.

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The €15 million equity round also received support from Bayern Kapital and existing investors, including IQ Capital, Earlybird, First Momentum, UnternehmerTUM, Creator Fund, Onsight Ventures, and several angel investors.

Kevin Berghoff, CEO and co-founder of QuantumDiamonds, said, “This is a major step in bringing quantum sensing into fabs worldwide. The response from leading chipmakers has been clear: they see our technology as essential for solving yield challenges that today’s systems can’t address. With deployments now live in the U.S. and Taiwan and serial production ramping up in Munich, Europe isn’t just participating in the next chip era, it’s helping define it.”

“Compute has become strategic infrastructure. Europe uses around 20% of the world’s semiconductors while producing only 10%, and that gap is exactly where our strategic power leaks away. QD can become Europe’s next ASML: a first-of-a-kind technology, built and scaled here, in a $104 billion equipment market that the entire AI economy depends on. Backing companies like QD is how Europe stops buying its technological future from others and starts building the leverage to shape its own,” said Daria Saharova, Managing Partner at World Fund.

Founded in 2022 by Berghoff and Dr. Fleming Bruckmaier (CTO) as a spin-out from the Technical University of Munich, QuantumDiamonds (QD) develops semiconductor inspection technology.

Its technology allows leading chip manufacturers to inspect and analyze their most advanced chips without damaging them, helping improve quality and production efficiency.

The company has developed a microscope that can detect electric currents inside semiconductor chips. It helps find hidden defects, improve chip production quality, and speed up the development of next-generation chip packaging technologies.