Funding

London’s PhysicsX Nears Unicorn With NVIDIA VC, €133M Series B

Nov 20, 2025 | By Kailee Rainse

London-based PhysicsX, a physical AI company advancing the future of engineering and manufacturing, has extended its Series B round with a new investment from NVentures, NVIDIA’s venture arm bringing total Series B funding to over €133 million ($155 million).

SUMMARY

  • London-based PhysicsX, a physical AI company advancing the future of engineering and manufacturing, has extended its Series B round with a new investment from NVentures, NVIDIA’s venture arm bringing total Series B funding to over €133 million ($155 million).

This brings PhysicsX’s valuation to nearly €863 million ($1 billion). The Series B round, led by Atomico in June 2025, includes participation from Temasek, Siemens, Applied Materials and July Fund, along with continued support from existing investors such as General Catalyst, NGP, Radius Capital, Standard Investments, and Allen & Co.

“The next industrial revolution will be AI-native – and the next generation of hardware will be imagined, designed, and proven in software. This investment reflects our investors’ shared conviction of that future,” said Jacomo Corbo, CEO & co-founder of PhysicsX.

In 2025, several European startups in physical AI, industrial automation, and AI-native engineering secured notable funding. Zurich-based mimic raised €13.8 million to advance frontier physical-AI robotics; Milan’s Cyberwave secured €7 million to connect AI agents with real-world industrial systems; and Stockholm’s Encube emerged from stealth with €19 million for its AI-powered hardware-development platform.

In total, these companies attracted roughly €39.8 million, reflecting steady though comparatively early-stage investment in AI-driven engineering and manufacturing solutions across Europe.

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Against this landscape, PhysicsX’s Series B extension, lifting its total to more than €133 million, places the UK company at a substantially higher funding scale than its peers and reinforces its position as one of Europe’s most well-capitalised players in physical-AI and advanced engineering in 2025.

“Together, we’re reimagining engineering and manufacturing and building the AI infrastructure to solve the most important industrial challenges of our time. The present can’t wait for tomorrow’s technologies and we’re working hard – with our customers, partners, and investors – to build the software that bridges that gap,” adds Corbo.

Co-founded in 2023 by Robin Tuluie, former Head of R&D at Renault (Alpine) F1 and Mercedes F1, and Jacomo Corbo, former Chief Scientist at QuantumBlack and Chief Race Strategist at Renault (Alpine) F1, PhysicsX is a physical AI company transforming engineering and manufacturing.

PhysicsX is developing an AI-native software stack that moves large-scale numerical physics simulation to inference, redefining how physical systems are designed, tested, manufactured, and operated. Its platform helps advanced manufacturers overcome the speed, scalability, and accuracy limitations of traditional simulation, delivering breakthrough performance across the product development lifecycle.

Headquartered in the UK with offices in London and New York, PhysicsX supports industries including aerospace, automotive, semiconductors, materials, mining, energy, and security. By enabling faster development cycles, improved productivity, and optimized performance, cost, and manufacturability, the company provides the technological backbone for software-defined engineering.

PhysicsX recently announced that its platform will be available on the NVIDIA-powered Industrial AI Cloud for Europe, in collaboration with Deutsche Telekom, reinforcing its commitment to sovereign industrial AI infrastructure and capabilities across critical sectors.

About PhysicsX

PhysicsX is a physical AI company transforming engineering and manufacturing. Its AI-native software stack accelerates the entire engineering lifecycle, helping aerospace, automotive, semiconductors, materials, and energy leaders tackle complex challenges.

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