Lightspring Raises €3.1 Mn to Scale 3D Photonic Chip Technology

The company has also been selected as a laureate of i-Lab, France’s national competition that supports innovative deeptech companies.

Lightspring develops and manufactures optical interfaces for photonic integrated circuits. Its technology is designed to improve the way light-based chips connect and communicate.

The company uses 3D lithography directly on chips to make photonic packaging more programmable and easier to manufacture. This aims to address one of the most expensive and difficult-to-repeat steps in the production of photonic technology.

Grégoire Bonnat, co-founder and CEO of Lightspring, said: “The whole industry is working on making photonic chips faster, yet light still loses most of its energy the moment it enters or leaves the device. We decided to attack that specific problem: to build the optical interface the same way the rest of the chip is built, in one reproducible process step."

“Lightspring has developed a technology that finally makes it scalable. We back teams with the potential to become the leaders of categories that don't exist yet, and Lightspring is definitely one of them.” Thomas Renaudin, Founding Partner at OVNI Capital

Lightspring was founded in 2026 in Besançon, France, by Grégoire Bonnat, Adrià Grabulosa and Daniel Brunner. The company is developing a new platform for integrating photonic technology using 3D manufacturing.

Lightspring uses 3D lithography directly on chips to improve the way photonic components are connected and packaged. This approach is designed to make the manufacturing process more flexible and easier to control.

According to the company, photonic packaging is currently one of the most expensive and difficult-to-reproduce steps in the production process. Lightspring aims to turn this step into a more programmable and efficient manufacturing process.

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