Keiron Raises €20.7 Mn Series A to Transform Electronics Manufacturing with LiFT Technology

The company develops Laser-Induced Forward Transfer (LiFT) technology, which is used for high-precision solder paste printing in advanced electronics manufacturing.

The funding round was co-led by Invest-NL, DeepTechXL, and Waves Capital. It also received support from Ramphastos Investments, ATUM Ventures, Cottonwood Technology Fund, and TNO Ventures, along with other new and existing investors.

“Solder paste printing has been the industry’s most expensive open secret for decades – a failure driver on a market worth well over €600 billion a year that everyone lived with because no one could fix it. This round lets us do exactly what the market has been asking for: put the HF2 on more lines, faster, without giving up an ounce of the precision that sets LiFT precision printing apart. Keiron isn’t patching a problem the industry has lived with for decades. We’re removing it, for good,” said Paul Rooimans, CEO and founder of Keiron Printing Technologies.

Hessel Mittelmeijer, Investment Manager and Sustainability Officer at DeepTechXL, said, “AI, defence growth, and increasing manufacturing complexity are accelerating the need for digital transformation in EMS. Keiron solves one of the industry’s biggest production challenges with a scalable, digital approach to solder paste printing. That’s why we led the seed round and continue to back the company as it scales.”

Founded in 2019, Keiron Printing Technologies is a DeepTech company based in Eindhoven, Netherlands, that aims to become a global leader in electronics manufacturing. The company has developed a digital LiFT precision solder paste printing system that improves how electronic components are assembled.

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Keiron's technology is designed to be more flexible, accurate, fast, and reliable than traditional stencil printing methods that have been used for many years. It helps manufacturers produce advanced and high-performance electronic products for industries with demanding technical requirements.