QuantumDiamonds Invests €150M In Quantum Chip Inspection Facility

The site, planned for eastern Munich, is expected to receive substantial public funding from the German federal and Bavarian governments under the European Chips Act.

QuantumDiamonds a spin-off from the Technical University of Munich, develops and commercializes quantum sensing technologies for semiconductor metrology and failure analysis. Its patented Quantum Diamond Microscopy (QDM) systems are used by foundries and integrated device manufacturers worldwide.

The company reports that QDM can detect internal defects missed by conventional methods, driving rising demand. Initial deployments are complete in Europe, with installations planned for the US and Taiwan in Q1 2026.

QuantumDiamonds’ QDM systems use nitrogen-vacancy centres in diamond to non-destructively map electrical currents with micrometre precision, even within complex chip packages.

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The company highlights this capability as critical for advanced 2.5D and 3D architectures in AI, mobile and automotive electronics.

According to CEO and co-founder Kevin Berghoff the new investment signals QuantumDiamonds’ transition toward global-scale production.

We’re building the tools the chip industry needs to inspect what was previously invisible and doing it in Germany, with European IP and talent.

The Munich facility will feature sensor production lines for quantum-grade diamond substrates, cleanroom integration for QDM inspection systems, joint development labs with semiconductor partners and application support for fab integration and inline process control.

Designated a first-of-a-kind facility under the European Chips Act, the project was chosen for Germany after evaluating US sites, citing strong expertise, supply chains and public–private innovation. A start-of-works confirmation allows construction and equipment procurement to begin while preserving eligibility for public funding.

About Quantum Diamonds

Founded in 2022 QuantumDiamonds develops and deploys world leading quantum sensing technologies for semiconductor failure analysis and metrology. Its advanced tools support next-generation chips enabling innovation in heterogeneous integration and advanced packaging for modern semiconductor applications.