German Deeptech Startup LIDROTEC Secures $13.5 M In Series A-2 Round To Tackle Semiconductor Yield Bottlenecks

The company’s laser systems use a unique approach that combines high-precision cutting with liquid-based cooling and cleaning, which reduces heat damage and particle defects. This helps lower chip breakage and improves yield, especially when working with hard or thin materials.

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With the new funding, LIDROTEC plans to speed up product development, expand its team, and scale delivery of its liquid-assisted laser dicing tech for both compound and advanced semiconductor markets.

“This funding is a major validation of our technology, team, and vision,” said Alexander Igelmann, Co-Founder and CEO of LIDROTEC.

“The support from both leading financial and strategic partners gives us the firepower to scale globally and help address the pressing inefficiencies in chip production.”

Lam Capital, the venture arm of Lam Research Corporation, and Goose Capital co-led the funding round. Other participants included ZEISS Ventures, NRW.BANK, and existing backers like Gründerfonds Ruhr. Several investors, including Goose Capital, contributed significantly more than their pro-rata share.

“LIDROTEC’s novel approach to chip singulation has the potential to deliver significant yield improvements to companies in the power device, photonics, and semiconductor sectors. We are looking forward to seeing their capabilities commercialised,” said Kevin Chen, managing director of Lam Capital and corporate development at Lam Research.

LIDROTEC recently added Ben Haskell, Investment Director at Lam Capital, to its board of directors.

“We’ve backed LIDROTEC since their first round and have only grown more confident in their potential to become a core enabler in semiconductor manufacturing,” said Ashok Rao, Board Member at Goose Capital.

“This team is solving a deeply technical problem with global relevance, and we’re proud to double down as they enter their next stage of growth.”

About LIDROTEC

LIDROTEC is a deep-tech startup from Germany that builds advanced laser systems for cutting semiconductor chips with high precision and minimal damage. Their technology uses ultrashort laser pulses along with a special liquid-based cooling and cleaning process. This helps reduce heat, avoid material damage, and keep the chip surface clean during cutting. The result is a faster, cleaner, and more efficient way to produce chips while saving resources.