NcodiN funding news – Optical Interposer Company NcodiN Raises €3.5 Million in Funding

An optical interposer created by NcodiN allows chiplets inside of processor packages to communicate optically with high bandwidth and low latency.

The optoelectronic components produced by the company are the result of almost 15 years of study at one of the leading academic institutions for nanophotonics in Europe, the CNRS Centre for Nanoscience and Nanotechnology near Paris.

For adopters, this technology unlocks fast, dependable, and energy-efficient data transport, enabling them to scale their top-tier processor architectures for extraordinarily demanding supercomputing workloads.

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This eliminates the need for conventional electrical interconnects and allows processor performance to be scaled to match the demands of AI and high-performance computing (HPC), which in turn meets the changing needs of scalers like Nvidia, Intel, and Qualcomm.

According to Manegatti, these initiatives helped the fledgling business break into the French IT scene and offered some funding in the form of zero-rate loans, which allowed it to start paying its first bills and hire its first employee in September of last year. Since then, the business has expanded to employ seven people.

Clément Vanden Driessche, Investment Director at Elaia: "Francesco, Bruno, Fabrice and the NcodiN team have identified a unique opportunity to transform the semiconductor industry with a new approach to photonic links."

Dr. Frédéric du Bois-Reymond, Partner at Earlybird-X notes: "We're convinced by their excellent research and excited about the commercial prospective it generates. Promising times ahead!"

In order to meet the demands of industrial clients, NcodiN's integrated optical link prototype (MVP) will be developed at a faster pace thanks to this fundraising round, which will also support the company's expansion.

About NcodiN

NcodiN is a Deeptech startup at the forefront of technological innovation, aiming to develop a groundbreaking optical interposer that will redefine system integration in High-Performance Computing and Artificial Intelligence processors.

Their patented nano-optoelectronic devices, integrated onto silicon, enable ultra-fast and energy efficient die-to-die interconnects using light as the vehicle of information, paving the way for the next generation of advanced system-in-package solutions.