CoolSem Technologies Secures Pre-Seed Funding For Wafer-Level Thermal Solutions

As demand for chips grows, raw material pressure is increasing, and heat management continues to limit performance. CoolSem Technologies addresses these challenges by enhancing energy efficiency extending hardware lifetimes and enabling the reuse of scarce materials, contributing to a more sustainable, circular semiconductor industry.

Founded in 2025 and based in Eindhoven the Netherlands CoolSem develops wafer level thermal management solutions for advanced semiconductor and photonic devices.

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Its WaLTIS multilayer stack replaces conventional substrates with an engineered structure that improves heat dissipation, mechanical stability and device reliability, enabling higher performance and longer lifetimes for semiconductor devices.

Commenting on the funding, CoolSem Technologies’ CEO, André van Geelen, said that thermal constraints are increasingly limiting semiconductor performance, particularly in RF, photonics and power applications, where traditional materials and packaging approaches are nearing their physical limits.

Olaf Joeressen, Senior Investment Manager at HTGF, added that the technology has the potential to become a core component of future chip thermal design, as thermal management becomes ever more critical to semiconductor performance.

The funding will support CoolSem Technologies in advancing its WaLTIS technology from concept to engineering samples with validation by leading customers in RF, power, and photonics. It will also enable qualification activities and real-world performance testing.

About CoolSem Technologies

Founded in 2025 and based in Eindhoven CoolSem Technologies develops wafer-level thermal management solutions for advanced semiconductor and photonic devices. Its WaLTIS multilayer stack replaces conventional substrates to improve heat dissipation, mechanical stability, and reliability, enabling higher performance, longer lifetimes and more efficient next-generation semiconductor devices.